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Wiring Devices
Integrated Wiring
제품 설명
LTE (Long Term Evolution) is the project name of a new high performance air interface for cellular mobile communication systems. It is the last step toward the 4th generation (4G) of radio technologies designed to increase the capacity and speed of mobile telephone networks. Where the current generation of mobile telecommunication networks are collectively known as 3G (for "third generation"), LTE is marketed as 4G.
Supports 10GBASE Ethernet and OTU2|OTU2e
Our SFP+ transceivers are designed by Tinout factory made 10G Ethernet SFP+ ZR, 1550nm, 80km, DDM/DOM, Low Power Dissipation, best price, 3year warranty, big stock, compatible with CISCO, HP, BROCADE, QLOGIC, H3C, JUNIPER, EXTREME.
SFP+ transceivers are designed for use in 10Gigabit Ethernet links up to 80km over Single Mode Fiber. They are compliant with SFF-8431, SFF-8432 and IEEE 802.3ae 10GBASE-ZR. The product is RoHS compliant and lead-free. For the OBSAI application, the rates are 6.144GB/s, 3.072 GB/s, 1.536 GB/s and 0.768 GB/s.
* For the OBSAI application, the rates are 6.144GB/s, 3.072 GB/s, 1.536 GB/s and 0.768 GB/s.
* For the CPRI application, the rates are 6.144GB/s, 3.072 GB/s, 2.4576 GB/s, 1.2288 GB/s, 0.6144 GB/s.
Package Form | Part No. | Fiber Type | Data Rate Range | Wavelength | Laser | Reach | Port | Case Temperature range | DDM | Application |
SFP+ | PLSFPP856GSW/I | MMF | 6.144G | 850nm | VSCEL/PIN | <300m | LC | Com./Ind. | D | LTE/ CPRI/ OBSAI |
SFP+ | PLSFPP136GLWM/I | MMF | 6.144G | 1310nm | FP/PIN | <220m | LC | Com./Ind. | D | LTE/ CPRI/ OBSAI |
SFP+ | PLSFPP136GLW02 | SMF | 6.144G | 1311nm | FP/PIN | 2km | LC | Ext. | D | LTE/ CPRI/ OBSAI |
SFP+ | PLSFPP136GLW10 | SMF | 6.144G | 1310nm | DFB/PIN | 10km | LC | Ext. | D | LTE/ CPRI/ OBSAI |
SFP+ | PLSFPP156GEX40 | SMF | 6.144G | 1550nm | EML/PIN | 40km | LC | Com. | D | LTE/ CPRI/ OBSAI |
SFP+ | PLSFPP156GZX80 | SMF | 6.144G | 1550nm | EML/APD | 80km | LC | Com. | D | LTE/ CPRI/ OBSAI |
BiDi SFP+ |
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Package Form | Part No. | Fiber Type | Data Rate Range | Wavelength | Laser | Reach | Port | Case Temperature range | DDM | Application |
BiDi SFP+ | PLSFPP6GBD2710D | SMF | 6.144G | 1270nm/1330nm | DFB/PIN | 10km | LC | Ext. | D | LTE/ CPRI/ OBSAI |
BiDi SFP+ | PLSFPP6GBD3310D | SMF | 6.144G | 1330nm/ 1270nm | DFB/PIN | 10km | LC | Ext. | D | LTE/ CPRI/ OBSAI |
BiDi SFP+ | PLSFPP6GBD2720D | SMF | 6.144G | 1270nm/1330nm | DFB/PIN | 20km | LC | Ext. | D | LTE/ CPRI/ OBSAI |
BiDi SFP+ | PLSFPP6GBD3320D | SMF | 6.144G | 1330nm/ 1270nm | DFB/PIN | 20km | LC | Ext. | D | LTE/ CPRI/ OBSAI |
BiDi SFP+ | PLSFPP6GBD2740D | SMF | 6.144G | 1270nm/1330nm | DFB/PIN | 40km | LC | Ext. | D | LTE/ CPRI/ OBSAI |
BiDi SFP+ | PLSFPP6GBD3340D | SMF | 6.144G | 1330nm/ 1270nm | DFB/PIN | 40km | LC | Ext. | D | LTE/ CPRI/ OBSAI |
BiDi SFP+ | PLSFPP6GBD2760D | SMF | 6.144G | 1270nm/1330nm | DFB/APD | 60km | LC | Com. | D | LTE/ CPRI/ OBSAI |
BiDi SFP+ | PLSFPP6GBD3360D | SMF | 6.144G | 1330nm/ 1270nm | DFB/APD | 60km | LC | Com. | D | LTE/ CPRI/ OBSAI |
CWDM SFP+ |
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Package Form | Part No. | Fiber Type | Data Rate Range | Wavelength | Laser | Power Budget | Port | Case Temperature range | DDM | Application |
SFP+ | PLSFPP6GCWB10-XX | SMF | 6.144G | CWDM | DFB/PIN | 10dB | LC | Com. | D | LTE/ CPRI/ OBSAI |
SFP+ | PLSFPP6GCWB16-XX | SMF | 6.144G | CWDM | DFB/PIN | 16dB | LC | Com. | D | LTE/ CPRI/ OBSAI |
SFP+ | PLSFPP6GCWB24-XX | SMF | 6.144G | CWDM | EML/APD | 24dB | LC | Com. | D | LTE/ CPRI/ OBSAI |
DWDM SFP+ |
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Package Form | Part No. | Fiber Type | Data Rate Range | Wavelength | Laser | Power Budget | Port | Case Temperature range | DDM | Application |
SFP+ | PLSFPP6GDMB16-XX | SMF | 6.144G | DWDM 100GHz | EML/PIN | 16dB | LC | Com. | D | LTE/ CPRI/ OBSAI |
SFP+ | PLSFPP6GDMB24-XX | SMF | 6.144G | DWDM 100GHz | EML/APD | 24dB | LC | Com. | D | LTE/ CPRI/ OBSAI |
주소:
Shenzhen, Guangdong, China
사업 유형:
제조사/공장, 그룹사
사업 범위:
공업 설비와 부품, 교통 운송, 전기전자, 컴퓨터 제품
경영시스템 인증:
ANSI/ESD, EICC, HSE, ISO 9000, ISO 9001, QC 080000
회사소개:
TINOUT CFP | SFP+ | XFP Corp는 2007년에 광섬유의 완벽한 기술 및 생산, 광도닉스 제품 및 네트워크 항목의 풍부한 기술 개발 능력을 갖춘 광섬유광학부품의 글로벌 선두 공급업체로 설립되었습니다.
이중 파이버 모듈은 두 개의 단일 모드 또는 다중 모드 광섬유를 통한 양방향 데이터 전송에 사용됩니다. 이 모듈에는 Tosa(송신기 광학 하위 조립품)와 Rosa(수신기 광학 하위 조립품)가 사용됩니다.
단일 파이버 모듈은 단일 광섬유를 통해 양방향으로 데이터를 전송하도록 설계되었습니다. 이 모듈에는 송신기와 수신기를 하나의 광 포트에 결합한 Bosa(양방향 광학 하위 조립품) 광학 어셈블리가 설치됩니다.