| 유전체: | 앵 |
|---|---|
| Finished Product: | Ceramic Circuit Board |
| Substrate Material: | Aluminum Nitride (Aln) Ceramic |
| Surface Metallization Process: | Mo-Mn Metallization and Ni Plating |
| Feature: | Strong Bonding Strength Between Ceramic and Metal |
| Usage: | to Realize Electrical Connections |
