PCB 테스트 프레임, 진열대 연소 테스트 PCBA 테스트 배아 프레임 PCB 툴링 전기 보드, 니들 보드
| 협상 가능 | 1 상품 (MOQ) |
최소 주문하다:
1 상품
포트:
Shenzhen, China
운송 패키지:
연락처
지불:
L/C, T/T, D/P, Western Union, Paypal, Money Gram
유사한 제품 찾기
제품 설명
회사 정보
주소:
501-505, Block B, Building 2, Overseas Decoration Building, No. 122 Zhenhua Road, Shenzhen, Guangdong, China
사업 유형:
제조사/공장
사업 범위:
가전제품, 전기전자
회사소개:
Shenzhen Entway Electronic Components Co., Ltd
Enterprise positioning: A high-tech enterprise specializing in the research and development, design, production, and sales of high-performance integrated circuits (ICs), chips, and electronic components, committed to providing core solutions for intelligent hardware, industrial Internet of Things, automotive electronics, and other fields.
Core advantages
1. Technical strength
· Having an independent research and development team, mastering core technologies such as analog circuits, digital signal processing (DSP), embedded systems, etc
· Obtained multiple invention patents and exclusive rights to integrated circuit layout design
· Passed ISO 9001 Quality Management System Certification and IATF 16949 Automotive Electronics Quality Management System Certification
2. Product layout
· Integrated circuits: Power management chips, signal chain chips, MCU microcontrollers
· Specialized chips: AIoT intelligent sensing chip, industrial control SoC, high-precision ADC/DAC
· Electronic components: High-frequency devices, power devices, passive components (resistors/capacitors/inductors)
3. Application scenarios
· Consumer electronics: Smartphones, smart home devices
· Industrial control: Industrial automation, motor drive
· Automotive electronics: In car entertainment systems, ADAS assisted driving
· In the field of new energy: Charging piles, energy storage management systems
Nature of Business
1. Research and Design
· Design and technological development of integrated circuits, semiconductor discrete devices, and optoelectronic devices
· Research and development of electronic component packaging and testing technology
2. Production and manufacturing
· High density integrated circuit packaging (SIP, BGA, etc. )
· Modular Chip Carrier (PCBA) Processing
· Surface treatment of semiconductor materials
3. System integration
· Provide integrated solutions for embedded software and hardware
· Customized electronic circuit design and simulation services
4. Market services
· Distribution and Supply Chain Management of Semiconductor Components
· Technical support and after-sales service
Enterprise positioning: A high-tech enterprise specializing in the research and development, design, production, and sales of high-performance integrated circuits (ICs), chips, and electronic components, committed to providing core solutions for intelligent hardware, industrial Internet of Things, automotive electronics, and other fields.
Core advantages
1. Technical strength
· Having an independent research and development team, mastering core technologies such as analog circuits, digital signal processing (DSP), embedded systems, etc
· Obtained multiple invention patents and exclusive rights to integrated circuit layout design
· Passed ISO 9001 Quality Management System Certification and IATF 16949 Automotive Electronics Quality Management System Certification
2. Product layout
· Integrated circuits: Power management chips, signal chain chips, MCU microcontrollers
· Specialized chips: AIoT intelligent sensing chip, industrial control SoC, high-precision ADC/DAC
· Electronic components: High-frequency devices, power devices, passive components (resistors/capacitors/inductors)
3. Application scenarios
· Consumer electronics: Smartphones, smart home devices
· Industrial control: Industrial automation, motor drive
· Automotive electronics: In car entertainment systems, ADAS assisted driving
· In the field of new energy: Charging piles, energy storage management systems
Nature of Business
1. Research and Design
· Design and technological development of integrated circuits, semiconductor discrete devices, and optoelectronic devices
· Research and development of electronic component packaging and testing technology
2. Production and manufacturing
· High density integrated circuit packaging (SIP, BGA, etc. )
· Modular Chip Carrier (PCBA) Processing
· Surface treatment of semiconductor materials
3. System integration
· Provide integrated solutions for embedded software and hardware
· Customized electronic circuit design and simulation services
4. Market services
· Distribution and Supply Chain Management of Semiconductor Components
· Technical support and after-sales service
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