기본 정보
신청
PCB, 컴퓨터, 통신, 휴대 전화, 통합 IC
IC Chip Type
Without Solder Ball
Customized Operation Temperature
-40 ~ 140 ºC
제품 설명
Product Description
eMCP BGA186 Test socket
1. Applicable for eMMC,eMCP devices from Samsung, Hynix, Sandisk, Toshiba, Kingston, Intel,etc, including BGA100, BGA136, BGA153, BGA169, BGA162, BGA186, BGA221, BGA254, BGA280, BGA529.
2. Support for eMMC version 5.0 or above.
3. Chip-off IC devices failure analysis, real time write-and-read in forensic application.
4. Support for hot plug, eMMC/eMCP can be directly connected to PC with SD port.
Product Parameters
Mechanical |
Material Socket Body | Torlon/PPS |
Material Socket Lid | AL, POM |
Contact | Pogo Pin |
Operation Temperature | -0 ~ 80 ºC |
Life Span | 50K Cycles |
Spring Force | 20g ~ 30g per Pin |
Electrical |
Current Rating | 2.59A |
DC Resistance | 42mΩ@0.65mm |
Specification
eMCP BGA186(702-0000867)
IC Size: 12x16mm
Solder Ball: without solder ball
Relative Products
Here it only shows a selection of sockets, for customized or other type, please have look at our website: siredatech.en.made-in-china.com.
Part Number | Description | IC Chip Type |
702-0000857 | BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
702-0000859 | BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
702-0000873 | BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 BA | With solder ball |
702-0000875 | BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 NB | Without solder ball |
702-0000865 | BGA186 0.5mm eMCP CS125 12x16mm SD B0 BA | With solder ball |
702-0000867 | BGA186 0.5mm eMCP CS125 12x16mm SD B0 NB | Without solder ball |
702-0000899 | BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
702-0001037 | BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
702-0001028 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
702-0001040 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
702-0000976 | BGA100 1.0mm eMMC CS125 14x18mm SD B0 BA | With solder ball |
702-0001035 | BGA100 1.0mm eMMC CS125 14x18mm SD B0 NB | Without solder ball |
702-0001315 | BGA136 0.5mm eMMC CS125 10x10mm SD B0 NB | Without solder ball |
702-0001326 | BGA136 0.5mm eMMC CS125 10x10mm SD B0 BA | With solder ball |
702-0000828 | BGA529 0.5mm eMCP CS125 15x15mm SD B0 BA | With solder ball |
702-0000830 | BGA529 0.5mm eMCP CS125 15x15mm SD B0 NB | Without solder ball |
702-0001028 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
702-0001040 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
702-0001586 | BGA254 0.5mm eMCP CS125 12x15mm SD B0 NB | Without solder ball |
702-0001587 | BGA280 0.45mm eMCP CS125 14x14.5mm SD B0 NB | Without solder ball |
702-0001685 | BGA153+162+221 0.5mm CS125 3 in1 SD B0 NB | Without solder ball |
Company Profile
Sireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.
Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.
Be the world's leading socket supplier
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.
Create value for our customers
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.
Certifications
Quality Management System-ISO 9001:2015, National High Technology Expertise, US Patent, Industrial Design, Patent for Utility Model etc.
Sireda has been authorized as National High Technology Expertise.
Sireda Technology Co., Ltd focuse on semiconductor test & rework solutions. Since established in 2010, we keep developing technology in IC test device, ATE test solution and provide fast & good test solution to customers worldwide.
Sireda is highly recognized by industry professionals as a company with growth potential.
Our Advantages
No MOQ | No MOQ limitation here. Our cooperation can begin with the sample and provide quality assurance to you before mass production. |
High Cost Performance | We provide products with high quality and competitive price. |
Technical Support | We have a professional R & D team and all the engineers have more than 5 years' experience. So we have the ability to design and produce best products according to our customers' requirements. |
Best Service | We provide inquiry and consulting & technical support for both pre-sale and after sale. Strictly quality control is in each production process. Our team are keep helping our customers to solve their problems anytime if needed. |
Our Exhibition and Customers
주소:
a Area, Floor6, Building 4, Hanhaida High-Tech Park, The Tenth Industry Estate, Gongming Tianliao, Shenzhen, Guangdong, China
사업 유형:
제조사/공장
사업 범위:
공업 설비와 부품, 서비스, 전기전자
경영시스템 인증:
ISO 9001
회사소개:
Sireda Technology Co., Ltd는 2010년에 설립되었습니다. CPU, 메모리, 전원 공급 장치, MCU, RF 등 모든 종류의 반도체 IC에 대한 반도체 테스트 소켓 및 테스트 설비의 제조를 전문으로 합니다. 또한 BGA IC 재작업, 리볼링 또는 BGA 리볼 스텐실을 제공합니다.
고급 지식과 기술을 갖춘 Sireda는 전 세계 고객에게 가장 경쟁력 있는 가격, 최고 품질, 최고의 맞춤형 디자인, 최단 소요 시간, 최고의 전문 서비스를 제공하기 위해 최선을 다하고 있습니다. 고객과 긴밀하게 협력하여 제조 효율성과 생산성을 높일 수 있습니다.
IC 테스트 소켓 공급업체로서 반도체 테스트 연구 및 혁신에 중점을 두고 있으며 많은 특허를 획득했습니다. National High-tech 및 ISO9001:2015 인증을 받으십시오. 고객 만족을 추구하는 것이 우리의 주요 목표이며, 우리는 처음부터 고객을 비즈니스 파트너로 삼습니다. 우리는 최상의 품질과 서비스를 제공하기 위해 고객의 요구를 이해하기 위해 최선을 다합니다.